Tj. Mouthaan et V. Petrescu, THE MODELING OF RESISTANCE CHANGES IN THE EARLY PHASE OF ELECTROMIGRATION, Microelectronics and reliability, 38(1), 1998, pp. 99-105
Sensitive measurements of the evolution of the resistance of aluminum
based metallisation stripes that have been electrically stressed with
large current densities show a rather unpredictable initial change fol
lowed by a more or less linear increase (less than 1%) for a considera
ble period of time. Ultimately, breakdown will occur preceded by an er
ratic behavior of the resistance. This paper reviews existing models f
or these early changes. It reviews the importance of a generation term
for vacancies separate from a divergence of flux term in the explanat
ion of small resistance changes in these models and proposes an altern
ative view that explains the linear behavior of the resistance change
and can also incorporate a variety of initial changes depending on ini
tial mechanical stress conditions. In this model it is assumed that el
ectron wind can create vacancies in the grain boundary regions that ar
e further redistributed because of the electrical current. In this cre
ation process less mobile damage is created, that contributes to the s
cattering of electrons and thus increases the resistance. (C) 1998 Els
evier Science Ltd.