HOT-CARRIER EFFECTS AND LIFETIME PREDICTION IN OFF-STATE OPERATION OFDEEP-SUBMICRON SOI N-MOSFETS

Citation
Sh. Renn et al., HOT-CARRIER EFFECTS AND LIFETIME PREDICTION IN OFF-STATE OPERATION OFDEEP-SUBMICRON SOI N-MOSFETS, I.E.E.E. transactions on electron devices, 45(5), 1998, pp. 1140-1146
Citations number
14
Categorie Soggetti
Engineering, Eletrical & Electronic","Physics, Applied
ISSN journal
00189383
Volume
45
Issue
5
Year of publication
1998
Pages
1140 - 1146
Database
ISI
SICI code
0018-9383(1998)45:5<1140:HEALPI>2.0.ZU;2-5
Abstract
Hot-carrier effects (HCE) induced by the parasitic bipolar transistor (PBT) action are thoroughly investigated in deep submicron N-channel S OI MOSFET's for a wide range of temperature and gate length. A multist age device degradation is highlighted for all the experimental conditi ons. Original V-t variations are also obtained for short-channel devic es, a reduction of the threshold voltage being observed for intermedia te values of stress time in the case of high stress drain biases. At l ow temperature (LT), an improvement of the device aging can be obtaine d in the low V-d range because of the significant reduction of the lea kage current in the PET regime. However, in the case of high V-d, sinc e the strong leakage current cannot be suppressed at LT, the device ag ing is larger than that obtained at room temperature. On the other han d, the device lifetime in off-state operation is carefully predicted a s a function of gate length with various methods. Numerical simulation s are also used in order to propose optimized silicon-on-insulator (SO I) architectures for alleviating the PET action and improving the devi ce performance and reliability.