M. Itoh et al., LOW-ENERGY FOCUSED-ION-BEAM SHAPE OBSERVATION AND ITS NOISE-REDUCTIONFOR NANOFABRICATION, Microelectronic engineering, 40(1), 1998, pp. 21-34
Two types of noise from the variable landing-energy focused-ion-beam (
FIB) system appeared when FIB was line-scanned on an n-GaAs wafer and
implantation-induced damage was estimated by using selective etching a
nd secondary electron microscope (SEM) observation. The first had a ro
ugh surface with small craters away from implanted lines and the secon
d had clearly observable scratchiness along implanted lines. Cathode l
uminescence measurement and auger analysis were performed to estimate
beam-tail spreading. Both the long-beam-tail and the scratchy noise pr
obably originated from unintentionally scattered beams in the ion-beam
lens column and/or neutral particles emitted from the liquid metal io
n source. As a result, these noises could be greatly reduced by locati
ng a new aperture at an appropriate position. Using this refined FIB s
ystem, low landing-energy-ion-beams should be able to be applied to fa
bricate high-quality mesoscopic devices.