V. Ramachandran et al., PREPARATION OF ATOMICALLY FLAT SURFACES ON SILICON-CARBIDE USING HYDROGEN ETCHING, Journal of electronic materials, 27(4), 1998, pp. 308-312
Hydrogen etching of 6H- and 4H-SiC(0001) surfaces is studied. The as-p
olished substrates contain a large number of scratches arising from th
e polishing process which are eliminated by hydrogen etching. Etching
is carried out in a flow of hydrogen gas at atmospheric pressure and t
emperatures around 1600-1700 degrees C attained on a tantalum strip he
ater. Post-etching atomic force microscopy images show periodic arrays
of atomically flat terraces that are a few thousand angstroms wide. T
hese terraces are separated by steps 15 Angstrom high in the < 1 (1) o
ver bar 00 > directions. Often, the surface is seen to be faceted with
steps on neighboring facets forming 60 degrees angles and offset in t
he c-direction by half a unit cell. Images of incompletely etched surf
aces show early stages of etching where one can see remnants of surfac
e damage in the form of arrays of hexagonal pits. On the larger scale,
the surface has a hill-and-valley type morphology. The observed featu
res are interpreted in a model based on the symmetry of the SiC unit c
ell and crystal miscut.