PREPARATION OF ATOMICALLY FLAT SURFACES ON SILICON-CARBIDE USING HYDROGEN ETCHING

Citation
V. Ramachandran et al., PREPARATION OF ATOMICALLY FLAT SURFACES ON SILICON-CARBIDE USING HYDROGEN ETCHING, Journal of electronic materials, 27(4), 1998, pp. 308-312
Citations number
12
Categorie Soggetti
Engineering, Eletrical & Electronic","Material Science
ISSN journal
03615235
Volume
27
Issue
4
Year of publication
1998
Pages
308 - 312
Database
ISI
SICI code
0361-5235(1998)27:4<308:POAFSO>2.0.ZU;2-8
Abstract
Hydrogen etching of 6H- and 4H-SiC(0001) surfaces is studied. The as-p olished substrates contain a large number of scratches arising from th e polishing process which are eliminated by hydrogen etching. Etching is carried out in a flow of hydrogen gas at atmospheric pressure and t emperatures around 1600-1700 degrees C attained on a tantalum strip he ater. Post-etching atomic force microscopy images show periodic arrays of atomically flat terraces that are a few thousand angstroms wide. T hese terraces are separated by steps 15 Angstrom high in the < 1 (1) o ver bar 00 > directions. Often, the surface is seen to be faceted with steps on neighboring facets forming 60 degrees angles and offset in t he c-direction by half a unit cell. Images of incompletely etched surf aces show early stages of etching where one can see remnants of surfac e damage in the form of arrays of hexagonal pits. On the larger scale, the surface has a hill-and-valley type morphology. The observed featu res are interpreted in a model based on the symmetry of the SiC unit c ell and crystal miscut.