NEW TRENDS IN PLASMA-ETCHING FOR ULTRA-LARGE-SCALE-INTEGRATION-TECHNOLOGY

Authors
JOUBERT O
Citation
O. Joubert, NEW TRENDS IN PLASMA-ETCHING FOR ULTRA-LARGE-SCALE-INTEGRATION-TECHNOLOGY, Microelectronic engineering, 42, 1998, pp. 17-24
Citations number
37
Categorie Soggetti
Optics,"Physics, Applied","Engineering, Eletrical & Electronic
Journal title
Microelectronic engineering → ACNP
ISSN journal
01679317
Volume
42
Year of publication
1998
Pages
17 - 24
Database
ISI
SICI code
0167-9317(1998)42:<17:NTIPFU>2.0.ZU;2-7
Abstract
Plasma etching is a key technology for Integrated Circuit fabrication. As the industry pushes to smaller dimensions with higher aspect ratio s, etching process optimization becomes always more challenging. This paper describes the trends in plasma etching of the three basic catego ries of materials processed in ultra large scale integration technolog y: silicon, dielectric, and metals for interconnection applications.