The success of ion beam lithography in the sub-0.13 mu m technology re
gion is partially dependent on the development of a low distortion mas
k. To that end, finite element analyses have been performed to predict
the distortions due to mounting of a stencil mask during exposure to
the ion beam. In addition, modeling techniques which allow for the det
ermination of in-plane distortions of specific pattern features during
fabrication have been developed. Results can be used to perform Patte
rn Specific Emulation (PSE).