The pattern placement accuracy of an x-ray lithography mask is affecte
d by thermomechanical distortion induced during the electron beam patt
erning process. Three-dimensional finite element models have been deve
loped to simulate the response of the membrane and resist stack and id
entify the in-plane distortions due to the e-beam writing. Thermal dis
placements (due to the e-beam heating) and mechanical displacements (d
ue to the resist in situ stress relief) were calculated for the ARPA-N
IST standard x-ray mask.