U. Westerwelle et al., PARTIALLY CARBOXYMETHYLATED NOVOLAKS FOR PHOTORESIST SYSTEMS - NEW PHOTORESISTS FOR DEVELOPMENT UNDER MILDLY ALKALINE CONDITIONS, Microelectronic engineering, 42, 1998, pp. 343-346
The dissolution behaviour of cresolic novolaks in alkaline developers
has been modulated by a modification reaction with chloroacetic acid (
'carboxymethylation'). This reaction effected a partial etherification
of the phenolic OH-groups. The desired solubility has been adjusted b
y the degree of conversion in combination with the choice of an approp
riate parent novolak. The influence of the carboxymethylation on the d
issolution rates of the resins turned out to be strongly dependent on
type and concentration of the developer. Moreover, different dissoluti
on kinetics have been observed in TMAH and sodium carbonate solution.
The lithographic properties of selected carboxymethylated novolaks hav
e been investigated. Photoresists have been optimised with respect to
environmental and safety aspects ('safer solvents', development in aqu
eous sodium carbonate solution). The formulation of negative resists h
as been complicated by an unexpected incompatibility of the resin and
the photoactive compound. However, first results of positive resist fo
rmulations were promising. Resolutions down to 1 mu m l&s have been ac
hieved.