MINIATURIZATION OF SI DIAPHRAGMS OBTAINED BY WAFER BONDING

A technology is presented to fabricate ultraminiature capacitive type sensing elements for use in blood pressure measurements with each of t hem having a side dimension of only 130 mu m. The devices that were ma de in an array configuration were fabricated using the silicon fusion bonding technique and self-aligned boron ion implantation. The process is simple requiring only three mask levels and high yield. Results ar e presented for both static and dynamic pressure conditions.