A quantitative evaluation of the local Si thickness of oxidized Si nan
ostructures was performed by scanning probe microscopy. Suppression of
oxidation by mechanical stress is a dominant factor in determining th
e shape of Si structures of widths <100 nm. Oxidation from below cause
d by oxygen diffusion in the buried oxide layer extends to a few hundr
ed nanometers from the pattern edge. The vertical position of the Si s
tructure can be changed within a few tens of nanometers by oxidation f
rom be:ow. As a result of co-occurence of these two phenomena, the loc
al thickness of the patterned Si layer can be controlled within a rang
e of 0-300% of the unpatterned area thickness.