Jv. Manca et al., LOCALIZED MONITORING OF ELECTROMIGRATION WITH EARLY RESISTANCE CHANGEMEASUREMENTS, Microelectronics and reliability, 38(4), 1998, pp. 641-650
A new approach is presented in order to study the local effects of ele
ctromigration in metallisations. So-called localized electrical resist
ance measurements allow us to detect and localize the formation of ind
ividual voids and hillocks in metallisation lines submitted to current
and temperature stress. Localized electrical resistance measurements
are performed by adding a number of voltage terminals at equal distanc
es on the test structure and by measuring the resistance drift of each
line segment. Through the use of such a multi-voltage probe (MVP) tes
t structure, the sensitivity of the electrical resistance to the prese
nce of defects is strongly increased. By comparing the observed electr
ical resistance drift results with the corresponding SEM micrographs?
important conclusions can be drawn concerning the nature of the resist
ance changes. With finite element calculations a quantitative interpre
tation is obtained of the observed local resistance changes. An additi
onal feature of localized electrical resistance measurements is the po
ssibility to determine the actual temperature profile present in a tes
t strip at the beginning of a current stress experiment, i.e., prior t
o failure formation. (C) 1998 Elsevier Science Ltd. All rights reserve
d.