OHMIC CONTACTS FORMATION OF SILICON SCHOTTKY DIODES BY SCREEN PRINTING AND RAPID ISOTHERMAL PROCESSING

Citation
D. Ratakonda et al., OHMIC CONTACTS FORMATION OF SILICON SCHOTTKY DIODES BY SCREEN PRINTING AND RAPID ISOTHERMAL PROCESSING, Journal of electronic materials, 27(5), 1998, pp. 402-404
Citations number
8
Categorie Soggetti
Engineering, Eletrical & Electronic","Material Science
ISSN journal
03615235
Volume
27
Issue
5
Year of publication
1998
Pages
402 - 404
Database
ISI
SICI code
0361-5235(1998)27:5<402:OCFOSS>2.0.ZU;2-5
Abstract
Rapid isothermal processing based on incoherent radiation as the sourc e of optical and thermal energy is playing a major role in flexible fa st-cycle time integrated circuits manufacturing. In this paper, are pr esent the dark and illuminated current-voltage characteristics of sili con Schottky barrier diodes where the ohmic contacts are formed by scr een printing and rapid isothermal annealing. These results are compare d with evaporated contacts followed by furnace annealing or rapid isot hermal annealing. In this paper, we have shown that the ohmic contacts formed by screen printing and rapid isothermal annealing are compatib le with the contacts formed by evaporation process. The processing tim e of the screen printed ohmic contacts is significantly lower than the contacts formed by evaporation process.