G. Meneghesso et al., FAILURE MECHANISMS OF ALGAAS INGAAS PSEUDOMORPHIC HEMTS - EFFECTS DUETO HOT-ELECTRONS AND MODULATION OF TRAPPED CHARGE/, Microelectronics and reliability, 37(7), 1997, pp. 1121-1129
The reliability of AlGaAs/InGaAs pseudomorphic HEMT's has been investi
gated by means of thermal and hot-electron accelerated tests. Two comm
ercially available devices have been tested, together with prototypes
fabricated by a European supplier. Different failure modes have been o
bserved after hot-electron testing, depending on the device type, i.e.
(a) increase of drain current, I-D and threshold voltage, \V-T\ which
can be attributed either to thermally-activated electron detrapping o
r to charge compensation by holes generated by impact ionization; (b)
decrease of I-D at low drain to source voltages, V-DS, with the develo
pment of a kink in the output characteristics, due to the generation o
f deep levels under the gate and subsequent electron trapping. In the
former case, (a), hot carriers and/or high temperature storage only mo
dulate the charge present on deep levels, leading to recoverable alter
ations of device characteristics. In the latter case, (b), the presenc
e of additional deep levels under the gate leads to a permanent degrad
ation. The link between the observed failure modes and the underlying
physical mechanism is investigated by means of different techniques, a
nd the main functional effects of the degradation modes are addressed.
(C) 1997 Elsevier Science Ltd.