In this work we report on hot-electron stress experiments performed on
commercial AlGaAs/InGaAs/GaAs pseudomorphic HEMTs. The stress cycles
induce a permanent increase of the gate-drain breakdown voltage (break
down walkout). Different characterization techniques are applied to th
e devices under test, consistently indicating that the physical mechan
ism underlying walkout is the build-up of negative charge in the regio
n between the gate and drain. (C) 1997 Elsevier Science Ltd.