THERMAL IMPEDANCES OF MULTI-FINGER HETEROJUNCTION BIPOLAR-TRANSISTORS

Authors
Citation
R. Anholt, THERMAL IMPEDANCES OF MULTI-FINGER HETEROJUNCTION BIPOLAR-TRANSISTORS, Solid-state electronics, 42(5), 1998, pp. 865-869
Citations number
6
Categorie Soggetti
Engineering, Eletrical & Electronic","Physics, Applied","Physics, Condensed Matter
Journal title
ISSN journal
00381101
Volume
42
Issue
5
Year of publication
1998
Pages
865 - 869
Database
ISI
SICI code
0038-1101(1998)42:5<865:TIOMHB>2.0.ZU;2-W
Abstract
Computed thermal impedances of thermally-shunted HBTs with 2 to 4 fing ers are compared with measurements, and several different HBT thermal designs are explored. To minimize self heating by adjacent elements, e ither the thermal shunt must be very thick or a flip-chip sink should be used. (C) 1998 Elsevier Science Ltd. All rights reserved.