K. Tajiri et al., PIT-FREE ELECTROPOLISHING OF ALUMINUM AND ITS APPLICATION FOR PROCESSCHAMBER, Journal of vacuum science & technology. A. Vacuum, surfaces, and films, 16(3), 1998, pp. 1196-1200
Citations number
3
Categorie Soggetti
Physics, Applied","Materials Science, Coatings & Films
Aluminum is one of the candidate materials of the vacuum chamber and c
omponents in the ultra-large scale integration device production facil
ities, because of high thermal conductivity and minimizing weight. For
that purpose, their surface must be smooth and passivated so as to ha
ve a low outgassing rate. An electropolishing method to obtain a mirro
r-finish and pit-free smooth surface has been developed by controlling
the flow of the electrolytic fluid during polishing. The polished sur
face, which shows an average roughness of 0.03 mu m was found to be co
vered with an oxide film of 200 nm thick as determined by Auger electr
on spectroscopy, indicating a chemically stable surface. The outgassin
g rate measurement using a conduction-modulation method shows the valu
e of 10(-10) Pa m(3) s(-1) m(-2), after baking treatment at 150 degree
s C. (C) 1998 American Vacuum Society. [S0734-2101(98)01403-1].