PIT-FREE ELECTROPOLISHING OF ALUMINUM AND ITS APPLICATION FOR PROCESSCHAMBER

Citation
K. Tajiri et al., PIT-FREE ELECTROPOLISHING OF ALUMINUM AND ITS APPLICATION FOR PROCESSCHAMBER, Journal of vacuum science & technology. A. Vacuum, surfaces, and films, 16(3), 1998, pp. 1196-1200
Citations number
3
Categorie Soggetti
Physics, Applied","Materials Science, Coatings & Films
ISSN journal
07342101
Volume
16
Issue
3
Year of publication
1998
Part
1
Pages
1196 - 1200
Database
ISI
SICI code
0734-2101(1998)16:3<1196:PEOAAI>2.0.ZU;2-Y
Abstract
Aluminum is one of the candidate materials of the vacuum chamber and c omponents in the ultra-large scale integration device production facil ities, because of high thermal conductivity and minimizing weight. For that purpose, their surface must be smooth and passivated so as to ha ve a low outgassing rate. An electropolishing method to obtain a mirro r-finish and pit-free smooth surface has been developed by controlling the flow of the electrolytic fluid during polishing. The polished sur face, which shows an average roughness of 0.03 mu m was found to be co vered with an oxide film of 200 nm thick as determined by Auger electr on spectroscopy, indicating a chemically stable surface. The outgassin g rate measurement using a conduction-modulation method shows the valu e of 10(-10) Pa m(3) s(-1) m(-2), after baking treatment at 150 degree s C. (C) 1998 American Vacuum Society. [S0734-2101(98)01403-1].