CHARACTERIZATION OF W FILMS ON SI AND SIO2 SI SUBSTRATES BY X-RAY-DIFFRACTION, AFM AND BLISTER TEST ADHESION MEASUREMENTS/

Contrary to most classical adhesion test, the blister test provides qu antitative adhesion energy measurements. We demonstrate its applicatio n to 1 mu m thick W films in tensile stress state deposited by xenon D C magnetron sputtering on PECVn/Si(100) substrates. The W films surfac e morphology; structure and residual stress were also characterized by atomic force microscopy, X-ray diffraction and substrate curvature me asurements as function of the deposition pressure. Films characteristi cs are compared with those of W films deposited directly on Si(100) su bstrates.