EFFECT OF SPUTTERING-CLEANING ON ADHESION OF THE METALLIC-FILMS TO POLYMER SUBSTRATES

The effect of sputtering-cleaning on adhesion and chemical bonding at the metal/polymer interface was studied. Titanium (Ti) films were depo sited on polymer substrates, polyethylene and polytetrafluoroethylene (PTFE) after sputtering-cleaning treatment. The sputtering-cleaning tr eatment consisted of argon ion irradiation at 0.3 keV. Adhesion was me asured by a pull test, and the chemical bonding at the interface was i nvestigated by X-ray photoelectron spectroscopy. Adhesion of both poly mer substrates was improved by sputtering-cleaning In the case of PE, the ratio of C-Ti bonding at the interface increased after sputtering- cleaning and resulted in adhesion improvement. C-Ti and F-Ti bonding a ppeared at the interface between the Ti film and the PTFE substrate, b ut improvement in adhesion of Ti/PTFE was attributed to the change of the interfacial morphology on the basis of the scanning electron spect roscopy observation and adhesion of Au to PTFE. (C) 1998 Elsevier Scie nce S.A. All rights reserved.