Va. Gritsenko et al., CHARACTERIZATION OF THE SILICON NITRIDE-THERMAL OXIDE INTERFACE IN OXIDE-NITRIDE-OXIDE STRUCTURES BY ELS, XPS, ELLIPSOMETRY, AND NUMERICAL-SIMULATION, Microelectronics and reliability, 38(5), 1998, pp. 745-751
This work studies the properties of the SiO2-Si3N4 interface in oxide-
nitride-oxide (ONO) structures by using energy loss spectroscopy, X-ra
y photoelectron spectroscopy, ellipsometry measurements and numerical
simulation. By oxidation the as-deposited Si3N4, silicon-silicon bonds
at Si3N4-thermal SiO2 interface are found. These excess Si-Si bonds a
re produced by replacing nitrogen with oxygen during the oxidation of
Si3N4. We further propose that the Si-Si bonds are the major trap cent
er at the Si3N4-SiO2 interface. With MINDO/3 numerical simulation, we
have found that the Si-Si bonds can capture both electrons and holes a
t the top Si3N4-SiO2 interface. These bonds are proposed to be the res
ponsible candidate for the positive charge accumulation in re-oxidized
nitrided oxide. (C) 1998 Elsevier Science Ltd. All rights reserved.