Implantation of B has been performed into an epitaxially grown layer o
f 6H SiC, at two different B concentrations, 2 x 10(16) cm(-3) and 2 x
10(18) cm(-3). Subsequently, an epitaxial layer was regrown on the B
implanted layer. The samples were investigated by transmission electro
n microscopy (TEM) and secondary ion mass spectrometry (SIMS). In the
highly B-doped layers plate-like defects were found, associated with l
arge strain fields, and an increased B concentration. These defects we
re stable at the originally implanted region during regrowth and at an
neal temperatures up to 1700 degrees C. In the samples implanted with
the lower B concentration, no crystal defects could be detected by TEM
. No threading dislocations or other defects were observed in the regr
own epitaxial layer, which shows the possibility to grow a layer with
high crystalline quality on B implanted 6H SiC. By SIMS, it was found
that B piles up at the interface to the regrown layer, which could be
explained by enhanced diffusion from an increased concentration of poi
nt defects created by implantation damage in the region. B is also spr
ead out into the original crystal and in the regrown layer at a concen
tration of below 2 x 10(16) cm(-3), with a diffusion constant estimate
d to 1.3 x 10(-12) cm(2)s(-1). This diffusion is most probably not dri
ven by implantation damage, but by intrinsic defects in the grown crys
tal. Our investigation shows that the combination of implantation and
subsequent regrowth techniques could be used in SiC for building advan
ced device structures, with the crystal quality in the regrown layer n
ot being deteriorated by crystal defects in the implanted region. A de
vice process using B implantation and subsequent regrowth could on the
other hand be limited by the diffusion of B.