B. Johnson et al., GRAIN NUCLEATION AND TEXTURE ANALYSIS OF ELECTROLESS COPPER DEPOSITION ON A PALLADIUM SEED LAYER, Journal of electronic materials, 27(7), 1998, pp. 923-927
Electroless copper grains were deposited on a Pd seed layer under vary
ing bath conditions. The seed layer was determined to have a (Ill)text
ure using grazing incident x-ray (GM) diffraction. Multiple nucleation
sites in the grain boundaries were imaged using a scanning tunneling
microscope. Continual copper growth produced row-like structures. The
texture of the electrolessly deposited copper (ED-Cu) grains were dete
rmined to be (111). No radial grain orientation for the Pd seed layer
or the ED-Cu thin film was detected using GM diffraction. Atomic force
microscope images indicated continual Cu nucleation throughout the de
position process. PdH was formed as a by-product of the electroless de
position process, and detected by x-ray diffraction.