Mc. Dossantos et O. Teschke, ALIGNED PIPE ARRAYS FORMATION BY SILICON ANODIC ETCHING, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 16(4), 1998, pp. 2105-2109
A simple technique is described here that produces aligned curved or s
traight arrays of pipes. This opens the way to produce complete system
s (electronic, photonic and fiber optic connectors) from silicon with
large scale fabrication techniques. Our strategy in creating parallel
pipes is to use high current densities (similar to 100 mA/cm(2)) silic
on anodization in HF solutions, in a cell where the current direction
and the preferential etching directions are not coincident in (111) si
licon substrates. The etched structure in a nanoscale range was observ
ed using atomic force microscopy, which shows steps. In a macroscopic
scale steps were observed in the walls of arrays of tenths of millimet
ers diameter pipes. Pores arrays were obtained forming a similar to 90
degrees angle with the current direction. Molecular mechanics simulat
ions of the pipe wall structure show that a preferential etching along
the < 100 > direction and passivation of the (111) planes are the mec
hanisms responsible for the formation of pore arrays structure. (C) 19
98 American Vacuum Society.