SIDE-BY-SIDE WAFER BONDING OF INP FOR USE WITH STEPPER-BASED LITHOGRAPHY

We have developed a simple technique for wafer bonding for use with st epper-based lithography. The technique involves side-by-side bonding o f two or more pieces of a wafer together with epoxy. A bonded wafer wi th the same dimensions, such as thickness, flatness, and position of t he large flat, as a whole wafer can be run on a stepper. Since a stepp er can align each field independently, all of the area without the act ual bond may be patterned. This technique is quite useful for salvagin g a broken wafer in the middle of processing. In addition, it may be u sed for bonding several substrates of different materials together for monolithic integration. (C) 1998 American Vacuum Society.