PHASE COARSENING AND CRACK-GROWTH RATE DURING THERMOMECHANICAL CYCLING OF 63SN37PB SOLDER JOINTS

Citation
Pl. Hacke et al., PHASE COARSENING AND CRACK-GROWTH RATE DURING THERMOMECHANICAL CYCLING OF 63SN37PB SOLDER JOINTS, Journal of electronic materials, 27(8), 1998, pp. 941-947
Citations number
14
Categorie Soggetti
Engineering, Eletrical & Electronic","Material Science
ISSN journal
03615235
Volume
27
Issue
8
Year of publication
1998
Pages
941 - 947
Database
ISI
SICI code
0361-5235(1998)27:8<941:PCACRD>2.0.ZU;2-Z
Abstract
The effects of phase coarsening in 63Sn37Pb solder joints produced by isothermal annealing and during thermo-mechanical cycling (TMC) on the fatigue cracked area growth rate dA(c)/dN were investigated. The phas e coarsening by isothermal annealing was in accord with the mechanism of interphase boundary diffusion; that during TMC was significantly gr eater than by isothermal annealing. The phase coarsening in the range considered (D = 1-5 mu m, N < 150 cycles) had only little, if any, inf luence on dA(c)/dN, which occurred mainly in Stage I of the fatigue cr ack growth rate regime. Results obtained previously, however, indicate that for N > 150 cycles dA(c)/dN is significantly decreased by a redu ction in the as-reflowed phase size. Reasonable agreement occurred bet ween the calculated fatigue lifetime vs initial as-reflowed phase size and that measured.