Pl. Hacke et al., PHASE COARSENING AND CRACK-GROWTH RATE DURING THERMOMECHANICAL CYCLING OF 63SN37PB SOLDER JOINTS, Journal of electronic materials, 27(8), 1998, pp. 941-947
The effects of phase coarsening in 63Sn37Pb solder joints produced by
isothermal annealing and during thermo-mechanical cycling (TMC) on the
fatigue cracked area growth rate dA(c)/dN were investigated. The phas
e coarsening by isothermal annealing was in accord with the mechanism
of interphase boundary diffusion; that during TMC was significantly gr
eater than by isothermal annealing. The phase coarsening in the range
considered (D = 1-5 mu m, N < 150 cycles) had only little, if any, inf
luence on dA(c)/dN, which occurred mainly in Stage I of the fatigue cr
ack growth rate regime. Results obtained previously, however, indicate
that for N > 150 cycles dA(c)/dN is significantly decreased by a redu
ction in the as-reflowed phase size. Reasonable agreement occurred bet
ween the calculated fatigue lifetime vs initial as-reflowed phase size
and that measured.