Va. Kulbachinskii et al., CONDUCTING WIRES EMBEDDED IN AN I-GAAS MATRIX FOR ELECTRONIC APPLICATIONS, Microelectronic engineering, 43-4, 1998, pp. 319-324
A method of fabricating quasi-1D conducting wires of tin embedded in a
n i-GaAs matrix has been developed. The method involves forming a syst
em of steps on vicinal surface of the GaAs(Cr) substrate misoriented 0
.3 degrees or 1 degrees from the (001) plane forward to the (110) basa
l plane and decorating the ends of these steps with Sn through molecul
ar-beam epitaxy. Transport properties of structures were measured in t
he temperature range 4.2-300 K at high electric fields up to E = 10(4)
V/cm using a pulse technique. (C) 1998 Elsevier Science B.V; All righ
ts reserved.