K. Machida et al., METAL-INSULATOR-METAL CAPACITORS BY USING ELECTRON-CYCLOTRON-RESONANCE PLASMA-SIO2, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 13(5), 1995, pp. 2013-2015
This paper describes the fabrication process and the reliable characte
ristics of a metal-insulator-metal capacitor using electron cyclotron
resonance plasma-SiO2 as an insulator film. The metal-insulator-metal
capacitors are additionally fabricated during the Al multilevel interc
onnection process since the deposition temperature of electron cyclotr
on resonance plasma-SiO2 is below 200 degrees C. Also, the leakage cur
rent characteristics of the him are excellent even without densificati
on at high temperature. The experimental results confirm that a metal-
insulator-metal capacitor fabrication process using electron cyclotron
resonance plasma-SiO2 can be applied to analog large scale integratio
n implementation. (C) 1995 American Vacuum Society.