Xs. Wang et al., ION SPUTTERING OF GAAS(110) - FROM INDIVIDUAL BOMBARDMENT EVENTS TO MULTILAYER REMOVAL, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 13(5), 1995, pp. 2031-2040
We have investigated the effects of ion mass (Ar+, Xe+), energy (0.3-5
keV), trajectory, and sample temperature on the ion sputtering proces
ses for GaAs(110). Scanning tunneling microscopy images reveal that mo
st ion bombardment events at 300 K create pits that are 1-5 unit cells
in size, indicating that direct knock-on collisions dominate. The ave
rage pit size increases moderately with ion energy but shows a signifi
cant variation with the incident angle. Vacancies are sufficiently mob
ile at 625-775 K that vacancy islands form and the yield can be determ
ined directly. The sputtering yields for these nearly ideal surfaces e
xhibit structure that can be related to the nuclear stopping power and
ion channeling, showing the influence of such geometric factors as su
rface path length, ion radius, and projected atom column density. Temp
erature dependent results for monolayer and multilayer sputtering show
that adatoms ejected onto the surface refill vacancies but that, the
surface roughness, as measured by surface width, increases with ion fl
uence. While interlayer atomic transport is measurable at 625K and inc
reases with temperature, it is not sufficient to achieve layer-by-laye
r removal because As-x desorption competes with interlayer transport a
bove similar to 800 K. (C) 1995 American Vacuum Society.