MECHANICAL-STRESS EVOLUTION AND THE BLECH LENGTH - 2D SIMULATION OF EARLY ELECTROMIGRATION EFFECTS

Authors
PETRESCU V MOUTHAAN AJ SCHOENMAKER W SALM C
Citation
V. Petrescu et al., MECHANICAL-STRESS EVOLUTION AND THE BLECH LENGTH - 2D SIMULATION OF EARLY ELECTROMIGRATION EFFECTS, Microelectronics and reliability, 38(6-8), 1998, pp. 1047-1050
Citations number
5
Categorie Soggetti
Engineering, Eletrical & Electronic
Journal title
Microelectronics and reliability → ACNP
ISSN journal
00262714
Volume
38
Issue
6-8
Year of publication
1998
Pages
1047 - 1050
Database
ISI
SICI code
0026-2714(1998)38:6-8<1047:MEATBL>2.0.ZU;2-D
Abstract
Modeling of stress and electromigration at the microscopic level, in c onfined interconnect metallic lines with tungsten studs, can very well account for the resistance behaviour in time. The resistance change a t saturation for a metallic line with blocking boundaries at both ends can be related, according to the model, to threshold product (jL)(c) found by Blech [1], (C) 1998 Elsevier Science Ltd. All rights reserved .