This study presents the hot carrier induced device degradation in 0.8
mu m RF-nMOSFET's within the general framework of the degradation mech
anism. It has been found that the device degradation model of a single
-finger gate MOSFET could be applied for a multi-finger gate RF-nMOSFE
T. The reduction of the cut-off frequency and maximum frequency after
stress can be explained by the decrease of transconductance and the in
crease of drain output conductance. (C) 1998 Elsevier Science Ltd. All
rights reserved.