CRACK MECHANISM IN WIRE BONDING JOINTS

Authors
RAMMINGER S TURKES P WACHUTKA G
Citation
S. Ramminger et al., CRACK MECHANISM IN WIRE BONDING JOINTS, Microelectronics and reliability, 38(6-8), 1998, pp. 1301-1305
Citations number
5
Categorie Soggetti
Engineering, Eletrical & Electronic
Journal title
Microelectronics and reliability → ACNP
ISSN journal
00262714
Volume
38
Issue
6-8
Year of publication
1998
Pages
1301 - 1305
Database
ISI
SICI code
0026-2714(1998)38:6-8<1301:CMIWBJ>2.0.ZU;2-3
Abstract
High voltage and high current power modules are key components for tra ction applications. While the modules are exposed to harsh stress cond itions all over their lifetime, high reliability is of decisive import ance in this field of application. In power electronic packages wire b onding is used for the electrical interconnection from the chips to th e output pins. Wire bond lift-off and solder fatigue are limiting the reliability. In this work we investigate the initiation and growth of cracks in the wire bands using finite-element analysis. (C) 1998 Elsev ier Science Ltd. All rights reserved.