THERMOMECHANICAL DEFORMATION IMAGING OF POWER DEVICES BY ELECTRONIC SPECKLE PATTERN INTERFEROMETRY (ESPI)

Authors
NASSIM K JOANNES L CORNET A DILHAIRE S SCHAUB E CLAEYS W
Citation
K. Nassim et al., THERMOMECHANICAL DEFORMATION IMAGING OF POWER DEVICES BY ELECTRONIC SPECKLE PATTERN INTERFEROMETRY (ESPI), Microelectronics and reliability, 38(6-8), 1998, pp. 1341-1345
Citations number
3
Categorie Soggetti
Engineering, Eletrical & Electronic
Journal title
Microelectronics and reliability → ACNP
ISSN journal
00262714
Volume
38
Issue
6-8
Year of publication
1998
Pages
1341 - 1345
Database
ISI
SICI code
0026-2714(1998)38:6-8<1341:TDIOPD>2.0.ZU;2-T
Abstract
We present an original imaging method to measure the three components of the surface displacement of working power devices with a nanometric resolution. The method takes advantage of the speckle structure of th e analysed object recorded on a CCD camera. This method is complementa ry of IR thermography and provides interesting information concerning stress and reliability in power devices. (C) 1998 Elsevier Science Ltd . All rights reserved.