ON-CHIP RELIABILITY INVESTIGATIONS ON POWER MODULES ACTUALLY WORKING IN INVERTER SYSTEMS

Authors
FRANKE T HONSBERGRIEDL M SMON P OTTO J RAMMINGER R SOELKNER G WOLFGANG E
Citation
T. Franke et al., ON-CHIP RELIABILITY INVESTIGATIONS ON POWER MODULES ACTUALLY WORKING IN INVERTER SYSTEMS, Microelectronics and reliability, 38(6-8), 1998, pp. 1361-1366
Citations number
5
Categorie Soggetti
Engineering, Eletrical & Electronic
Journal title
Microelectronics and reliability → ACNP
ISSN journal
00262714
Volume
38
Issue
6-8
Year of publication
1998
Pages
1361 - 1366
Database
ISI
SICI code
0026-2714(1998)38:6-8<1361:ORIOPM>2.0.ZU;2-X
Abstract
The paper contains the results of temperature measurements for reliabi lity investigations on IGBT modules actually working in inverters for industrial and traction applications. For this, the chip temperature a nd its transient behaviour have been monitored under different driving conditions of the inverters. Specially prepared IGBT-modules have bee n used to investigate the industrial and the traction inverters in the ir electrical and thermal behaviour. The measurement techniques were s uitably adapted to the different configurations of the two inverters. (C) 1998 Elsevier Science Ltd. All rights reserved.