U. Konig et al., SI SIGE FIELD-EFFECT TRANSISTORS, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 16(5), 1998, pp. 2609-2614
Over the last few years, SiGe heterodevices with outstanding rf perfor
mance have been introduced to meet the needs of modern consumer electr
onics, which require novel silicon-based low cost-high speed component
s with improved current gain, low noise, and reduced power consumption
operating in the GHz range. This article reviews device and the first
circuit results of lateral modulation doped SiGe modulation doped het
ero-field-effect transistors (MODFETs) with Schottky gates as well as
lateral and vertical SiGe metalorganic field effect transistors (MOSFE
Ts) focusing on de characteristics, rf performance comprising cutoff f
requencies, delays, and on layer design. With an f(max), of up to 92 G
Hz, the highest maximum frequency of oscillation reported so far for a
ny Si-based FET, and transconductances g(me) up to 470 mS/mm, the n-Si
Ge MODFET is presently improving in speed with combining the advantage
s of heterodevices with well-established Si technology. For p-SiGe MOD
FETs cutoff frequencies f(t) of 70 GHz and f(max) of 84 GHz have been
measured. A reduced gate leakage and an improved voltage swing is achi
eved using MOS-gated heterodevices. For p-channel SiGe hetero-MOSFETs
room temperature transconductances up to 210 mS/mm for 0.25 mu m gate-
length devices have been measured. Vertical MOSFETs allow further devi
ce scaling into the deep sub-100 nm range and thus enable us to overco
me performance limits due to minimum feature sizes using state-of-the-
art lithography techniques. (C) 1998 American Vacuum Society.