INVESTIGATION OF CITRIC-ACID HYDROGEN-PEROXIDE ETCHED GAAS AND AL0.3GA0.7AS SURFACES BY SPECTROSCOPIC ELLIPSOMETRY

Authors
Citation
Pg. Snyder et Sj. Cho, INVESTIGATION OF CITRIC-ACID HYDROGEN-PEROXIDE ETCHED GAAS AND AL0.3GA0.7AS SURFACES BY SPECTROSCOPIC ELLIPSOMETRY, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 16(5), 1998, pp. 2680-2685
Citations number
25
Categorie Soggetti
Physics, Applied","Engineering, Eletrical & Electronic
ISSN journal
10711023
Volume
16
Issue
5
Year of publication
1998
Pages
2680 - 2685
Database
ISI
SICI code
1071-1023(1998)16:5<2680:IOCHEG>2.0.ZU;2-R
Abstract
GaAs (100) surfaces were etched in citric acid-hydrogen peroxide (C6H8 O7:H2O2) solutions with volume ratios ranging from 1:1 to 10:1. Ex sit u variable angle spectroscopic ellipsometry measurements (1.5-5.5 eV) were made before and after etching for periods of up to 8 min. Analysi s of these data indicated that low volume ratios (less than or equal t o 2:1), with corresponding low etch rates, produced a thin interfacial layer (which might represent microscopic roughness) beneath a porous oxide. For a 1:1 ratio the interfacial layer thickness increased with etch time, while for a 2:1 ratio it stabilized at a small value (congr uent to 2 nm). Higher volume ratios (greater than or equal to 3:1), as sociated with much higher etch rates, produced qualitatively different overlayers which were more absorbing and 4-6 nm thick. Their optical constants could be modeled as a mixture of a small fraction (typically 5%-10%) of crystalline arsenic in a low-dielectric medium, using an e ffective medium approximation. Similar effects were seen in etched Al0 .3Ga0.7As surfaces. Low etch rates (volume ratio of 5:1 or less) resul ted in nearly normal oxide overlayers. A high etch rate (volume ratio 10:1) resulted in an absorbing layer similar to the one seen on rapidl y etched GaAs surfaces, 8-12 nm thick. (C) 1998 American Vacuum Societ y.