Pg. Snyder et Sj. Cho, INVESTIGATION OF CITRIC-ACID HYDROGEN-PEROXIDE ETCHED GAAS AND AL0.3GA0.7AS SURFACES BY SPECTROSCOPIC ELLIPSOMETRY, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 16(5), 1998, pp. 2680-2685
GaAs (100) surfaces were etched in citric acid-hydrogen peroxide (C6H8
O7:H2O2) solutions with volume ratios ranging from 1:1 to 10:1. Ex sit
u variable angle spectroscopic ellipsometry measurements (1.5-5.5 eV)
were made before and after etching for periods of up to 8 min. Analysi
s of these data indicated that low volume ratios (less than or equal t
o 2:1), with corresponding low etch rates, produced a thin interfacial
layer (which might represent microscopic roughness) beneath a porous
oxide. For a 1:1 ratio the interfacial layer thickness increased with
etch time, while for a 2:1 ratio it stabilized at a small value (congr
uent to 2 nm). Higher volume ratios (greater than or equal to 3:1), as
sociated with much higher etch rates, produced qualitatively different
overlayers which were more absorbing and 4-6 nm thick. Their optical
constants could be modeled as a mixture of a small fraction (typically
5%-10%) of crystalline arsenic in a low-dielectric medium, using an e
ffective medium approximation. Similar effects were seen in etched Al0
.3Ga0.7As surfaces. Low etch rates (volume ratio of 5:1 or less) resul
ted in nearly normal oxide overlayers. A high etch rate (volume ratio
10:1) resulted in an absorbing layer similar to the one seen on rapidl
y etched GaAs surfaces, 8-12 nm thick. (C) 1998 American Vacuum Societ
y.