The need for higher DRAM densities, for cost effective manufacturing a
nd the price pressure puts the DRAM development on a highly innovative
path. The fast pace with which DRAM cell sizes are reduced results in
many technology issues. This talk discusses the deep trench cell arch
itecture, its advantages and the main technology innovations that have
made the aggressive scaling of the DRAM cell possible. The issues rel
ated to Gbit DRAMs, the new challenges and potential innovations will
be presented.