Gr. Bai et al., IN-SITU LOW-TEMPERATURE GROWTH AND ORIENTATION CONTROL IN MOCVD PZT RUO2 THIN-FILM HETEROSTRUCTURES ON SIO2/SI SUBSTRATES/, Integrated ferroelectrics (Print), 21(1-4), 1998, pp. 291-304
Pb(Zr0.5Ti0.5)O-3/RuO2 (PZT/RuO2) thin film heterostructures with cont
rolled PZT and RuO2 orientation were successfully grown in-situ on SiO
2/(001)Si substrates at 525 degrees C, using metal-organic chemical va
por deposition (MOCVD). XRD analysis revealed that the textured orient
ation of the PZT films is strongly dependent on the orientation of RuO
2 bottom electrode layers, PZT layers grown on (101)-textured RuO2 exh
ibit a predominant (001) orientation, while those grown on (110)-textu
red RuO2 present a mixed (001)-(111)-(110) polycrystalline structure.
Highly (110)oriented RuO2 layers were grown using relatively high depo
sition temperatures and low rates (similar to 350 degrees C and < 3 nm
/min, respectively), while (101)-textured RuO2 layers were grown at sl
ightly lower temperatures and higher deposition rates than those for (
110) layers (i.e., similar to 300 degrees C and > 3 nm/min, respective
ly). The RuO2 layers exhibited resistivities of 34-40 mu Omega-cm, ave
rage grain size of 65+/-15 nm, and surface roughness of 3-10 nm (rms),
while the PZT layers were dense with average grain size of 150-250 nm
. Ag/PZT (001)/RuO2(101) capacitors exhibited remanent polarization, s
aturation polarization, and coercive field of 49.7 mu C/cm(2), 82.5 mu
C/cm(2), and 35.0 kv/cm, respectively, while the values for Ag/PZT (0
01-111-110)/RuO2(110) capacitors were 21.5 mu C/cm(2), 35.4 mu C/cm(2)
, and 39.0 kv/cm, respectively.