DESIGN AND APPLICATION OF MULTIWAFER MOCVD SYSTEMS FOR FERROELECTRICS

Metalorganic chemical vapor deposition (MOCVD) has been established as the most favoured method for the processing of (Ba,Sr)TiO3, Pb(Zr,Ti) O-3 and SrBi2Ta2O9 thin films. Due to good step coverage, uniformity o f thickness and composition as well as throughput MOCVD will certainly be the choice for the mass production of future electroceramic thin f ilm based devices such as volatile and non-volatile memories, electroo ptic devices, microactuators and sensors. Since many groups showed in a laboratory scale that electroceramic thin films deposited by MOCVD t echniques are suitable for future applications in terms of electrical and mechanical properties, the need for production worthy tools is rap idly increasing. In this paper we present a large scale manufactor too l (capacity up to 4 x 300 mm) which meets all demands for an automized mass production of electroceramic thin films.