He. Maes et al., ASSESSMENT OF OXIDE RELIABILITY AND HOT-CARRIER DEGRADATION IN CMOS TECHNOLOGY, Microelectronic engineering, 40(3-4), 1998, pp. 147-166
The techniques and methodologies to be applied in R&D laboratories for
the assessment of thin gate dielectrics reliability and hot carrier d
egradation are reviewed. Examples are given on how the application of
these techniques allows to obtain a better insight in the physics of t
he degradation process. Two such examples are given related to the Die
lectric breakdown of thin gate dielectrics and on the Stress-Induced L
eakage Current in thin dielectrics.