This paper does not constitute an overall review of the role of interf
aces in the use of silicides in current microelectronic technology. Ho
wever, for the sake of some degree of completeness, most of the uses o
f silicides, be it infrared detection or thermoelectric generation, ar
e mentioned and some recent references listed. Emphasis is given to fo
ur different topics. The first is the use of PtSi for ohmic and rectif
ying contacts; this provides the opportunity a) to look at the develop
ment of planar device metallization, starting with aluminum, and b) to
survey briefly elements of the theory of Schottky and ohmic contacts
to semiconductors. A second topic is the epitaxy of silicides on silic
on, with a brief discussion of beta-FeSi2, recently shown to be electr
oluminescent, What is known about grain boundary diffusion in silicide
s and other intermetallic compounds is reviewed with some speculation
about the structure of grain boundaries and the consequences for silic
ide growth via solid state reactions. Finally, the role of epitaxy bet
ween various morphological variations of TiSi2 is examined because of
the important place of this silicide in metal oxide semiconductor fiel
d effect transistor technology.