The effect of co-implantation of Si and Be in GaAs is discussed in the
light of tailoring of a MESFET implantation profile. The modified pro
file is calculated by considering electrical activation and diffusion
of both Si and Be in GaAs. The results compare well with a realized n-
layer measured by the C-V technique. Since the pinch-off voltage is a
figure of merit of device performance, a calculation of the latter usi
ng a tailored implantation profile is also presented in this paper. (C
) 1998 Elsevier Science Ltd. All rights reserved.