DIRECTIONAL DEPOSITION OF CU INTO SEMICONDUCTOR TRENCH STRUCTURES USING IONIZED MAGNETRON SPUTTERING

Authors
CHENG PF ROSSNAGEL SM RUZIC DN
Citation
Pf. Cheng et al., DIRECTIONAL DEPOSITION OF CU INTO SEMICONDUCTOR TRENCH STRUCTURES USING IONIZED MAGNETRON SPUTTERING, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 13(2), 1995, pp. 203-208
Citations number
10
Journal title
Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena → ACNP
ISSN journal
10711023
Volume
13
Issue
2
Year of publication
1995
Pages
203 - 208
Database
ISI
SICI code
1071-1023(1995)13:2<203:DDOCIS>2.0.ZU;2-M