STRICT THERMAL NITRIDATION SELECTIVITY BETWEEN SI AND GE USED AS A CHEMICAL PROBE OF THE OUTERMOST LAYER OF SI1-XGEX ALLOYS AND GE SI(001) OR SI/GE(001) HETEROSTRUCTURES/
D. Aubel et al., STRICT THERMAL NITRIDATION SELECTIVITY BETWEEN SI AND GE USED AS A CHEMICAL PROBE OF THE OUTERMOST LAYER OF SI1-XGEX ALLOYS AND GE SI(001) OR SI/GE(001) HETEROSTRUCTURES/, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 12(4), 1994, pp. 2699-2704
The thermal reactivity of NH3 with Si(001), Ge(001), Si1-xGex(001), an
d thinly Ge-covered Si(001) or Si-covered Ge(001) surfaces has been st
udied by means of in situ x-ray photoelectron spectroscopy in a temper
ature domain (T approximately 600-degrees-C) compatible with the usual
growth of Ge-Si based heterostructures. A very marked difference betw
een Si(001) and Ge(001) initial sticking coefficients is found, the la
tter surface being totally inert against nitridation by NH3 in contras
t with the Si(001) surface. This nitridation selectivity provides easy
access to information about surface termination in different situatio
ns where Si and Ge are potentially mixed, the reactivity depending on
whether Si appears at the reactive interface or not. As a test, compar
ing the nitrogen uptake curves in the early stages of NH3 exposure, fo
r all the studied structures except Si(001), a Ge-like initial stickin
g coefficient or a non-nitriding behavior is found. This is fairly exp
lained on the basis of the well-known concepts of the Stranski-Krastan
ov growth mode for the Ge/Si system and by Ge surface segregation for
the Si1-xGex and Si/Ge systems. Our result also implies the need of pl
asma-assisted treatments in order to achieve simultaneous Si and Ge ni
tridation of SiGe alloys.