Gg. Barna et al., SENSOR INTEGRATION INTO PLASMA ETCH REACTORS OF A DEVELOPMENTAL PILOTLINE, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 12(4), 1994, pp. 2860-2867
During the course of the Microelectronics Manufacturing Science and Te
chnology (MMST) program, a number of sensors have been integrated into
various test-bed plasma etch reactors with the goal of monitoring, di
agnosing, and controlling these processes. These sensors include singl
e wavelength and spectral ellipsometers for real-time in situ etch rat
e and endpoint determination; a standard monochromator for etch rate a
nd nonuniformity measurements; an eddy current sensor for incoming met
al thickness control; a rf monitor for rf current and voltage diagnost
ics; and a scatterometry-based critical dimension sensor for linewidth
measurements. The full integration of these sensors turned out to be
a complex and time-consuming task including hardware, optical, softwar
e, material, and processing issues. Once integrated into the reactor,
and the appropriate process modeling completed, these sensors enabled
the monitoring, diagnosis, and model-based control of these processes.
Besides maintaining specific process observables at their target valu
es, running under process control has highlighted phenomena such as eq
uipment aging and first-wafer effects. This work has clearly shown tha
t the full implementation of sensors into commercial manufacturing equ
ipment is essential for the model-based control and diagnosis of semic
onductor processes.