Ys. Chung et al., MORPHOLOGY AND PHASE OF TIN OXIDE THIN-FILMS DURING THEIR GROWTH FROMTHE METALLIC TIN, Journal of vacuum science & technology. A. Vacuum, surfaces, and films, 15(3), 1997, pp. 1108-1112
Citations number
14
Categorie Soggetti
Physics, Applied","Materials Science, Coatings & Films
Thin tin films were deposited on oxidized silicon substrates by sputte
ring. Changes in both the phase and morphology of the films were studi
ed as a function of the annealing process, time and atmosphere. X-ray
diffraction (XRD) analysis was used to study phase evolution of the fi
lms during annealing. Atomic force microscopy and scanning electron mi
croscopy were employed to characterize microstructure and morphology o
f the films. XRD analyses revealed phase transformations from metallic
Sn to romarchite and finally to cassiterite as a function of higher a
nnealing temperature. Differences in the phase transformation rate fro
m metallic tin films to tin dioxide were observed between oxygen and a
ir atmospheres. Little variation in grain size was observed during oxi
dation annealing from metallic to oxide states in either air or oxygen
. However, surface roughness of the films was strongly dependent on th
e annealing atmospheres. The films annealed under air showed that surf
ace roughness increased linearly with time and temperature, while the
surface roughness change of the tin oxide films annealed under oxygen
exhibited saturation behavior. The surface morphology change of the ti
n oxide films processed in oxygen exhibited different behavior from th
ose processed in air. (C) 1997 American Vacuum Society.