Hc. Lu et al., COMPOSITIONAL AND MECHANISTIC ASPECTS OF ULTRATHIN OXYNITRIDE FILM GROWTH ON SI(100), Microelectronic engineering, 36(1-4), 1997, pp. 29-32
The oxynitridation of Si(100) by various sequences of NO, N2O and O-2
exposures have been examined using high resolution medium energy ion s
cattering (MEIS) to determine accurate N and O concentrations and dept
h profiles. The results demonstrate that: 1) NO-produced oxynitride fi
lms have a higher concentration of N in them relative to N2O films, 2)
N, once incorporated, significantly retards the rate of continued oxi
dation (or nitridation) in proportion to the N concentration, and 3) c
oncurrent to nitridation near the interface, under certain conditions
N2O exposure may remove N from a film in the overlayer beyond the near
-interfacial (similar to 1.5nm) region, whereas NO is much less effect
ive at removing N.