STRESS-INDUCED LEAKAGE CURRENT IN ULTRA-THIN GATE OXIDES AFTER CONSTANT-CURRENT STRESS

Citation
A. Scarpa et al., STRESS-INDUCED LEAKAGE CURRENT IN ULTRA-THIN GATE OXIDES AFTER CONSTANT-CURRENT STRESS, Microelectronic engineering, 36(1-4), 1997, pp. 145-148
Citations number
6
Categorie Soggetti
Optics,"Physics, Applied","Engineering, Eletrical & Electronic
Journal title
ISSN journal
01679317
Volume
36
Issue
1-4
Year of publication
1997
Pages
145 - 148
Database
ISI
SICI code
0167-9317(1997)36:1-4<145:SLCIUG>2.0.ZU;2-0
Abstract
Constant current stress induced leakage currents are studied in very t hin oxide devices, for both stress polarities. This current has been i nvestigated for both positive and negative gate voltage measurements. Stress induced leakage current (SILC) physical nature has been studied and an interpretation has been proposed, considering local oxide weak spots with barrier height close to 1eV. The increasing rate of the SI LC versus the injection dose has been studied and compared with the de gradation positive charge build-up rate, observed in the same oxide, i ndicating that hole trapping and stress induced leakage current could have the same physical origin.