A. Scarpa et al., STRESS-INDUCED LEAKAGE CURRENT IN ULTRA-THIN GATE OXIDES AFTER CONSTANT-CURRENT STRESS, Microelectronic engineering, 36(1-4), 1997, pp. 145-148
Constant current stress induced leakage currents are studied in very t
hin oxide devices, for both stress polarities. This current has been i
nvestigated for both positive and negative gate voltage measurements.
Stress induced leakage current (SILC) physical nature has been studied
and an interpretation has been proposed, considering local oxide weak
spots with barrier height close to 1eV. The increasing rate of the SI
LC versus the injection dose has been studied and compared with the de
gradation positive charge build-up rate, observed in the same oxide, i
ndicating that hole trapping and stress induced leakage current could
have the same physical origin.