A method for surface preparation of 6H-SiC with different plasma sourc
es (oxygen, anti nitreous oxide) to reduce defects in deposited gate o
xides is presented. CV- (Capacitance-Voltage) measurements prove that
by suitable processing defect densities call be reduced by one order o
f magnitude down in the range of 10(11) cm(-2) In contrast to silicon
nitrogen disturbs the deposition of oxides on SiC. By AES (Angel Elect
ron Spectroscopy) measurements the different behavior of nitrogen at t
he SiO2/SiC interface compared to the SiO2/Si interface is analyzed.