A new method for measuring the interface properties, using diamond ter
minated silicon p-n diodes, is used to quantify the electrical quality
and to determine the conduction mechanism of the silicon/diamond inte
rface for two types of diamond. It was found that a high concentration
of surface states in the interface caused the diode leakage current t
o increase. The results also suggest a solution to suppress electrical
degradation by introducing a thin silicon dioxide layer between the s
ilicon and the diamond film.