Since the mid-1980s, electron back-scatter diffraction (EBSD, also kno
wn as back-scatter Kikuchi diffraction, BKD) has become a well-known a
nd often used technique for interrogating the local characteristics of
microstructures. The more recent development of orientation imaging m
icroscopy (OIM) has led to the practical application of EBSD in obtain
ing statistically relevant information from bulk materials. Many new d
evelopments in OIM technology have evolved recently. One of these is t
he development of rapid and more reliable mapping of multi-phase alloy
s. In addition, significant work has been performed on thin film struc
tures including patterned films and integrated circuits for investigat
ion of texture evolution, grain growth, and circuit reliability. An ad
ditional example showing the application of OIM on rough surface speci
mens, such as fracture surfaces, is discussed.