STRESS-RELAXATION IN MOLDING COMPOUNDS

Authors
KENNER VH HARPER BD ITKIN VY
Citation
Vh. Kenner et al., STRESS-RELAXATION IN MOLDING COMPOUNDS, Journal of electronic materials, 26(7), 1997, pp. 821-826
Citations number
11
Categorie Soggetti
Engineering, Eletrical & Electronic","Material Science
Journal title
Journal of electronic materials → ACNP
ISSN journal
03615235
Volume
26
Issue
7
Year of publication
1997
Pages
821 - 826
Database
ISI
SICI code
0361-5235(1997)26:7<821:SIMC>2.0.ZU;2-6
Abstract
Stress relaxation tests have heen carried out on an epoxy-based moldin g compound at temperatures ranging from ambient to 260 degrees C. It i s found that horizontal shifting produces coherent master curves which are different for different levels of imposed strain. i.e., the mater ial behavior is nonlinear. The use of constant strain rate tensile tes t data to augment stress relaxation data in forming the broadest visco elastic representation of the material is discussed.